Description
Dimensions
194 mm x 92 mm x 15 mm (7.6” x 3.6” x 0.6”)
Weight
380 g (13.4 oz)
Processor
Qualcomm® Snapdragon 626 MSM8953 Pro, 8 cores 2.2 GHz
Graphics
Adreno 506
RAM and Storage
4 GB / 64 GB
Operating System
Android 11 (GMS)
Android Enterprise Recommended
Display
6” capacitive multi-touch (10 points)
1080×1920 pixels
Sunlight readable
Glove/rain mode
Corning® Gorilla® Glass
Buttons
Front: F1, F2, F3, power
Side: FN, volume up/down
Battery
3.8V 8000 mAh (30.4 Wh), field replaceable
Ports
Type-C, OTG
Qualcomm quick charge 3.0
GNSS antenna connector
Back connector for expandability
1x micro SDXC (256 GB)
2x nano SIM
Communication
Cellular:
(WWAN)2G (850,900,1800,1900)
3G (1,2,5,8)
4G/LTE (1,2,3,4,5,7,8,12,13,17,20,25,26,28,38,39,40,41)
Wireless LAN:
2.4 GHz + 5 GHz
802.11a/b/g/n/ac
PAN: BT V4.2 LE
NFC: 13.56 MHz
ISO 14443A/B, ISO 15693
Audio
Headphone support via Type-C
Front-facing speaker
Microphone
Positioning
GPS/AGPS/GLONASS/Galileo/BeiDou
Cameras
Rear: 13 megapixel with auto-focus and flash
Front: 5 megapixel
Sensors
Gyroscope
Compass
Accelerometer
Pressure
Proximity
Ambient light
Environment
Operating: -20°C to 55°C (-4°F to 131°F)
MIL-STD-810G, Method 501.5/502.5 Procedure II
Storage: -40°C to 70°C (-40°F to 158°F)
MIL-STD-810G, Method 501.5/502.5 Procedure I
Drop / Shock: 6 drops from 1.5m, concrete surface
IEC 68-2-32:1990
Vibration: MIL-STD-810H:2019 Method 514.8/Procedure I
Mechanical: MIL-STD-810H:2019 Method 516.8/Procedure I
Sand / Dust: IP67, IEC 60529
Water: IP67, IEC 60529
Humidity: 0% ～ 95% (non-condensing)
MIL-STD-810G, Method 507.5 Procedure II
Altitude: 4572 m (15 000 ft)
MIL-STD-810G, Method 500.5 Procedures I & II
EMC/EMI: MIL-STD-461F, CE101, CE102, CS101, CS114, CS115, CS116, RE101, RE102, RS101, RS103
Additional Security
Qualcomm® Processor Security
Qualcomm® Content Protection
Qualcomm® Device Lock Authentication
